Embedded cooling of electronic devices : conduction, evaporation, and single- and two-phase convection (Record no. 200870)
[ view plain ]
| 000 -LEADER | |
|---|---|
| fixed length control field | 02065nam a22002777a 4500 |
| 003 - CONTROL NUMBER IDENTIFIER | |
| control field | OSt |
| 005 - DATE AND TIME OF LATEST TRANSACTION | |
| control field | 20260724171454.0 |
| 008 - FIXED-LENGTH DATA ELEMENTS--GENERAL INFORMATION | |
| fixed length control field | 260724b |||||||| |||| 00| 0 eng d |
| 020 ## - INTERNATIONAL STANDARD BOOK NUMBER | |
| ISBN | 9789811277931 |
| 041 ## - LANGUAGE CODE | |
| Language code of text/sound track or separate title | eng |
| 082 ## - DEWEY DECIMAL CLASSIFICATION NUMBER | |
| Classification number | 621.381 IYE-E |
| 245 ## - TITLE STATEMENT | |
| Title | Embedded cooling of electronic devices : conduction, evaporation, and single- and two-phase convection |
| 260 ## - PUBLICATION, DISTRIBUTION, ETC. (IMPRINT) | |
| Place of publication | Singapore; |
| Name of publisher | World Scientific Publishing Co. Pte. Ltd., |
| Year of publication | 2024. |
| 300 ## - PHYSICAL DESCRIPTION | |
| Number of Pages | xxiv, 364p. |
| 440 ## - SERIES STATEMENT/ADDED ENTRY--TITLE | |
| Title | WSPC Series in Advanced Integration and Packaging ; |
| Volume number/sequential designation | Vol. 8 |
| 520 ## - SUMMARY, ETC. | |
| Summary, etc | This book is a comprehensive guide on emerging cooling technologies for processors in microelectronics. It covers various topics such as chip-embedded two-phase cooling, monolithic microfluidic cooling, numerical modeling, and advances in materials engineering for conduction-limited direct contact cooling, with a goal to remedy high heat flux issues.The book also discusses the co-design of thermal and electromagnetic properties for the development of light and ultra-high efficiency electric motors. It provides an in-depth analysis of the scaling limits, challenges, and opportunities in embedded cooling, including high power RF amplifiers and self-emissive and liquid crystal displays. Its analysis of emerging cooling technologies provides a roadmap for the future of cooling technology in microelectronics.This book is a good starting point for the electrical and thermal engineers, as well as MS and PhD students, interested in understanding and collaboratively tackling the complex and multidisciplinary field of microelectronics device (embedded) cooling. A basic knowledge of heat conduction and convection is required. |
| 650 ## - SUBJECT ADDED ENTRY--TOPICAL TERM | |
| Topical Term | Electronic apparatus and appliances |
| 650 ## - SUBJECT ADDED ENTRY--TOPICAL TERM | |
| Topical Term | Heat conduction |
| 650 ## - SUBJECT ADDED ENTRY--TOPICAL TERM | |
| Topical Term | Thermal management (Engineering). |
| 650 ## - SUBJECT ADDED ENTRY--TOPICAL TERM | |
| Topical Term | Microelectronics. |
| 700 ## - ADDED ENTRY--PERSONAL NAME | |
| Personal name | Iyengar, Madhusudan, ed. |
| 700 ## - ADDED ENTRY--PERSONAL NAME | |
| Personal name | Weibel, Justin A., ed. |
| 700 ## - ADDED ENTRY--PERSONAL NAME | |
| Personal name | Asheghi, Mehdi, ed. |
| 942 ## - ADDED ENTRY ELEMENTS (KOHA) | |
| Koha item type | Books and Monographs |
| Full call number | Accession Number | Koha item type | Lost status | Damaged status | Permanent Location | Current Location | Shelving location | Date acquired | Source of acquisition | Cost, normal purchase price |
|---|---|---|---|---|---|---|---|---|---|---|
| 621.381 IYE-E | 103117 | Books and Monographs | Central Library, NIT Jalandhar | Central Library, NIT Jalandhar | General Stacks | 23.07.2026 | New Delhi, Shankar's Book Agency Pvt. Ltd. | 14089.60 |