CMOS past, present and future
Material type:
TextPublication details: Duxford, Cambridge, UK : Woodhead publishing 2018.Description: 263pISBN: - 9780081021392
- 621.39732 RAD-C
| Item type | Current library | Home library | Call number | Materials specified | Status | Date due | Barcode | |
|---|---|---|---|---|---|---|---|---|
| Books and Monographs | Central Library, NIT Jalandhar General Stacks | Central Library, NIT Jalandhar | 621.39732 RAD-C (Browse shelf(Opens below)) | Available | 99327 |
Basics of metal-oxide-semiconductor field-effect transistor (MOSFET) / H.H. Radamson -- Scaling and evolution of device architecture / H.H.
Radamson, E. Simeon, J. Luo, G. Wang -- Strain engineering / H.H. Radamson -- High-κ dielectric and metal gate / C. Zhao, X. Wang, W. Wang --
Channel materials / H.H. Radamson, E. Simeon -- Challenges in ultra-shallow junction technology / E. Simoen, H.H. Radamson -- Advanced
contact technology / J. Luo, K.P. Jia -- Advanced interconnect technology and reliability / Y. Li, C. Zhao
CMOS Past, Present and Future provides insight from the basics, to the state-of-the-art of CMOS processing and electrical characterization, including the integration of Group IV semiconductors-based photonics. The book goes into the pitfalls and opportunities associated with the use of hetero-epitaxy on silicon with strain engineering and the integration of photonics and high-mobility channels on a silicon platform. It begins with the basic definitions and equations, but extends to present technologies and challenges, creating a roadmap on the origins of the technology and its evolution to the present, along with a vision for future trends. The book examines the challenges and opportunities that materials beyond silicon provide, including a close look at high-k materials and metal gate, strain engineering, channel material and mobility, and contacts. The book's key approach is on characterizations, device processing and electrical measurements.
