000			02065nam a22002777a 4500
003			OSt
005			20260724171454.0
008			260724b |||||||| |||| 00| 0 eng d
020			_a9789811277931
041			_aeng
082			_a621.381 IYE-E
245			_aEmbedded cooling of electronic devices : conduction, evaporation, and single- and two-phase convection
260			_aSingapore; _bWorld Scientific Publishing Co. Pte. Ltd., _c2024.
300			_axxiv, 364p.
440			_aWSPC Series in Advanced Integration and Packaging ; _vVol. 8 _991042
520			_aThis book is a comprehensive guide on emerging cooling technologies for processors in microelectronics. It covers various topics such as chip-embedded two-phase cooling, monolithic microfluidic cooling, numerical modeling, and advances in materials engineering for conduction-limited direct contact cooling, with a goal to remedy high heat flux issues.The book also discusses the co-design of thermal and electromagnetic properties for the development of light and ultra-high efficiency electric motors. It provides an in-depth analysis of the scaling limits, challenges, and opportunities in embedded cooling, including high power RF amplifiers and self-emissive and liquid crystal displays. Its analysis of emerging cooling technologies provides a roadmap for the future of cooling technology in microelectronics.This book is a good starting point for the electrical and thermal engineers, as well as MS and PhD students, interested in understanding and collaboratively tackling the complex and multidisciplinary field of microelectronics device (embedded) cooling. A basic knowledge of heat conduction and convection is required.
650			_aElectronic apparatus and appliances _991056
650			_aHeat conduction _991057
650			_aThermal management (Engineering). _991058
650			_aMicroelectronics. _991059
700			_aIyengar, Madhusudan, ed. _991060
700			_aWeibel, Justin A., ed. _991061
700			_aAsheghi, Mehdi, ed. _991062
942			_cBK
999			_c200870 _d200870