Embedded cooling of electronic devices : conduction, evaporation, and single- and two-phase convection
Material type:
TextLanguage: English Series: WSPC Series in Advanced Integration and Packaging ; Vol. 8Publication details: Singapore; World Scientific Publishing Co. Pte. Ltd., 2024.Description: xxiv, 364pISBN: - 9789811277931
- 621.381 IYE-E
| Item type | Current library | Home library | Collection | Call number | Materials specified | Status | Date due | Barcode | |
|---|---|---|---|---|---|---|---|---|---|
| Books and Monographs | Central Library, NIT Jalandhar General Stacks | Central Library, NIT Jalandhar | Mechanical Engineering | 621.381 IYE-E (Browse shelf(Opens below)) | Available | 103117 |
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| 621.199 AMI-C Cogeneration and polygeneration systems | 621.2 VAC-H Hydraulic fluid power : fundamentals, applications, and circuit design | 621.31243 YAZ-T Thermoelectric energy conversion devices and systems | 621.381 IYE-E Embedded cooling of electronic devices : conduction, evaporation, and single- and two-phase convection | 621.4021 GAN-T Thermodynamics : basic and applied | 621.4021 GAN-T Thermodynamics : basic and applied | 621.4021 GAN-T Thermodynamics : basic and applied |
This book is a comprehensive guide on emerging cooling technologies for processors in microelectronics. It covers various topics such as chip-embedded two-phase cooling, monolithic microfluidic cooling, numerical modeling, and advances in materials engineering for conduction-limited direct contact cooling, with a goal to remedy high heat flux issues.The book also discusses the co-design of thermal and electromagnetic properties for the development of light and ultra-high efficiency electric motors. It provides an in-depth analysis of the scaling limits, challenges, and opportunities in embedded cooling, including high power RF amplifiers and self-emissive and liquid crystal displays. Its analysis of emerging cooling technologies provides a roadmap for the future of cooling technology in microelectronics.This book is a good starting point for the electrical and thermal engineers, as well as MS and PhD students, interested in understanding and collaboratively tackling the complex and multidisciplinary field of microelectronics device (embedded) cooling. A basic knowledge of heat conduction and convection is required.